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ISSN Approved Journal || eISSN: 2582-8185 || CODEN: IJSRO2 || Impact Factor 8.2 || Google Scholar and CrossRef Indexed

Peer Reviewed and Referred Journal || Free Certificate of Publication

Research and review articles are invited for publication in March 2026 (Volume 18, Issue 3) Submit manuscript

Firmware based Bug Finding Mechanisms in Pre-Silicon Environment

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  • Firmware based Bug Finding Mechanisms in Pre-Silicon Environment

Ankit Chandankhede *

Senior Member of Technical Staff, Advanced Micro Devices, Inc, Texas, USA

Review Article
 
International Journal of Science and Research Archive, 2020, 01(01), 133-140.
Article DOI: 10.30574/ijsra.2020.1.1.0030
DOI url: https://doi.org/10.30574/ijsra.2020.1.1.0030

Received on 10 October 2020; revised on 23 November 2020; accepted on 26 November 2020

In continuous progression of Moore’s Law, modern architectures in CPU , GPU and custom chips have introduced different features based on the modern application of datacenters, gaming consoles and edge computing. This has significantly increased the complexity of design space and exponentially increased the verification space. With increasing competition, it is pivotal to reduce the verification cycles as well as meet the bug finding techniques tap-out milestone. Quality of the verification can be easily achieved with the bug finding techniques proposed in this paper. These techniques not only facilitate to finding bugs at early stage of design but also provide the quality metric to sign off the closing milestones. Further proposed method provides the evaluation and confidence in health of design based on the market centric workloads.

Firmware; Bug Finding Mechanisms; Pre-Silicon Environment; Bug finding techniques; Bug finding techniques

https://ijsra.net/sites/default/files/fulltext_pdf/IJSRA-2020-0030.pdf

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Ankit Chandankhede. Firmware based Bug Finding Mechanisms in Pre-Silicon Environment. International Journal of Science and Research Archive, 2020, 01(01), 133-140. Article DOI: https://doi.org/10.30574/ijsra.2020.1.1.0030

Copyright © Author(s). All rights reserved. This article is published under the terms of the Creative Commons Attribution 4.0 International License (CC BY 4.0), which permits use, sharing, adaptation, distribution, and reproduction in any medium or format, as long as appropriate credit is given to the original author(s) and source, a link to the license is provided, and any changes made are indicated.


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