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ISSN Approved Journal || eISSN: 2582-8185 || CODEN: IJSRO2 || Impact Factor 8.2 || Google Scholar and CrossRef Indexed

Peer Reviewed and Referred Journal || Free Certificate of Publication

Research and review articles are invited for publication in March 2026 (Volume 18, Issue 3) Submit manuscript

Mental health in tech workplace: An analysis

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  • Mental health in tech workplace: An analysis

Madhurima Paul * and Swapan Das

Department of Computing & Analytics, Faculty of Data Science, NSHM Knowledge Campus, Kolkata, India.

Review Article
 
International Journal of Science and Research Archive, 2023, 10(01), 221–233.
Article DOI: 10.30574/ijsra.2023.10.1.0743
DOI url: https://doi.org/10.30574/ijsra.2023.10.1.0743

Received on 01 August 2023; revised on 09 September 2023; accepted on 12 September 2023

In recent years, there has been a significant research and analysis on the role of mental health in reaching global sustainable development goals. Employees are more likely to experience mental illnesses as a result of workplace stress. Mental illness can result in depression, personality disorders, phobias, anxiety disorders, mood disorders, psychotic disorders and a few more. In this study, we analyzed the Open Sourcing Mental Illness (OSMI) (osmihelp.org) Mental Health in Tech Survey dataset to determine the root causes of mental health disorders among the employees. Here, we looked at the severity of mental illness among working employees based on a variety of factors or attributes, including self-employment, mental health history in the employee's family, company offering benefits, whether the employee is receiving treatment for mental illness, and much more. We then attempted to build a fundamental machine learning model to predict whether an employee requires medical attention or not.

Mental health; Stress; OSMI; Employee; Machine learning

https://ijsra.net/sites/default/files/fulltext_pdf/IJSRA-2023-0743.pdf

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Madhurima Paul and Swapan Das. Mental health in tech workplace: An analysis. International Journal of Science and Research Archive, 2023, 10(01), 221–233. Article DOI: https://doi.org/10.30574/ijsra.2023.10.1.0743

Copyright © Author(s). All rights reserved. This article is published under the terms of the Creative Commons Attribution 4.0 International License (CC BY 4.0), which permits use, sharing, adaptation, distribution, and reproduction in any medium or format, as long as appropriate credit is given to the original author(s) and source, a link to the license is provided, and any changes made are indicated.


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